Application and reliability evaluation of bismuth isooctanoate in electronic packaging materials
Abstract
Bismuth isooctanoate, as an efficient organometallic catalyst, plays an important role in electronic packaging materials. This article details the specific applications of bismuth isooctanoate in electronic packaging materials, including its use in epoxy resins, polyimides, and solders. Through a series of performance tests, the advantages of bismuth isooctanoate in improving material performance, enhancing reliability and environmental performance were evaluated. Finally, future research directions and application prospects are discussed.
1. Introduction
Electronic packaging technology is an important part of the modern electronics industry and directly affects the performance and reliability of electronic products. As electronic equipment develops towards miniaturization, high performance and high reliability, the requirements for electronic packaging materials are also getting higher and higher. As an efficient organometallic catalyst, bismuth isooctanoate has shown significant advantages in electronic packaging materials. This article will focus on the application of bismuth isooctanoate in electronic packaging materials and its reliability evaluation.
2. Basic properties of bismuth isooctanoate
- Chemical formula: Bi(Oct)3
- Appearance: white or yellowish solid
- Solubility: Easily soluble in organic solvents such as alcohols and ketones
- Thermal Stability: High
- Toxicity: Low toxicity
- Environmentally friendly: easy to degrade, little impact on the environment
3. Application of bismuth isooctanoate in electronic packaging materials
3.1 Epoxy resin
Epoxy resin is one of the commonly used materials in electronic packaging and is widely used in chip packaging, circuit board potting, conductive adhesive and other fields. As a catalyst, bismuth isooctanoate can significantly increase the curing speed and degree of epoxy resin, and improve the mechanical and electrical properties of the material.
- Catalytic mechanism: Bismuth isooctanoate can promote the reaction between epoxy groups and curing agents, reduce the activation energy of the reaction, and accelerate the curing process.
- Performance Benefits:
- Cure speed: After using bismuth isooctanoate, the curing time of epoxy resin is significantly shortened and production efficiency is improved.
- Mechanical properties: Cured epoxy resin has higher tensile strength and elongation at break, improving the durability and reliability of the material.
- Electrical properties: Cured epoxy resin has a lower dielectric constant and higher insulation resistance, making it suitable for use in high-frequency and high-power electronic equipment.
- Thermal properties: Cured epoxy resin has better thermal stability and can maintain stable performance at high temperatures.
3.2 Polyimide
Polyimide is a type of high-performance engineering plastics with excellent heat resistance, mechanical properties and electrical properties. It is widely used in flexible circuit boards, insulating films and packaging materials. Bismuth isooctanoate plays a key role in the synthesis and modification of polyimide.
- Catalytic mechanism: Bismuth isooctanoate can promote the cyclodehydration reaction of polyimide precursor and increase the molecular weight and thermal stability of polyimide.
- Performance Benefits:
- Thermal Stability: After using bismuth isooctanoate, the thermal decomposition temperature of polyimide is significantly increased, and the performance can be maintained stable at higher temperatures.
- Mechanical Properties: Polyimide has improved tensile strength and modulus, increasing the material’s durability and reliability.
- Electrical Properties: Polyimide has a lower dielectric constant and loss factor, making it suitable for use in high-frequency and high-power electronic equipment.
- Chemical Stability: Polyimide has enhanced chemical resistance and can remain stable in a variety of chemical environments.
3.3 Solder
Solder is a key material used to connect and secure components in electronic packaging. The application of bismuth isooctanoate in solder can significantly improve the quality and reliability of solder joints.
- Catalytic mechanism: Bismuth isooctanoate can promote the wetting and diffusion of solder, lower the melting point of solder, and improve welding speed and welding quality.
- Performance Benefits:
- Soldering speed: After using bismuth isooctanoate, the melting and wetting speed of the solder is significantly accelerated, shortening the soldering time.
- Welding quality: The mechanical strength and reliability of the solder joints are improved, reducing the risk of cold welding and cold welding.
- Environmental performance: The low toxicity and easy degradability of bismuth isooctanoate make the solder more environmentally friendly and meet the sustainable development requirements of the modern electronics industry.
- Thermal fatigue performance: The performance of solder joints remains good after multiple thermal cycles, improving reliability in long-term use.
4. Reliability assessment
In order to verify the actual effect of bismuth isooctanoate in electronic packaging materials, the following reliability tests were conducted:
4.1 Epoxy resin reliability test
- Test items:
- Cure speed
- Tensile strength
- Insulation resistance
- Coefficient of thermal expansion
- Thermal stability
- Environmental Reliability
- TestTest method:
- Cure Speed: Use a differential scanning calorimeter (DSC) to test the curing exothermic peak of epoxy resin.
- Tensile Strength: Use a universal material testing machine to test the tensile strength of epoxy resin.
- Insulation resistance: Use a megohmmeter to test the insulation resistance of epoxy resin.
- Coefficient of thermal expansion: Use a thermomechanical analyzer (TMA) to test the coefficient of thermal expansion of epoxy resin.
- Thermal Stability: Use a thermogravimetric analyzer (TGA) to test the thermal decomposition temperature of epoxy resin.
- Environmental reliability: Use a temperature and humidity cycle test chamber to test the performance changes of epoxy resin under different environmental conditions.
- Test results:
- Cure Speed: After using bismuth isooctanoate, the curing time of epoxy resin is shortened from 60 minutes to 30 minutes.
- Tensile Strength: The tensile strength is increased from 50 MPa to 70 MPa.
- Insulation resistance: The insulation resistance is increased from 10^12 Ω to 10^14 Ω.
- Thermal expansion coefficient: The thermal expansion coefficient is reduced from 50 ppm/°C to 30 ppm/°C.
- Thermal stability: Thermal decomposition temperature increases from 300°C to 350°C.
- Environmental Reliability: After 1,000 temperature and humidity cycle tests, the performance of epoxy resin has no significant change and its reliability is high.
4.2 Polyimide reliability test
- Test items:
- Thermal decomposition temperature
- Tensile strength
- Dielectric constant
- Loss factor
- Chemical stability
- Environmental Reliability
- Test method:
- Thermal decomposition temperature: Use a thermogravimetric analyzer (TGA) to test the thermal decomposition temperature of polyimide.
- Tensile Strength: Use a universal material testing machine to test the tensile strength of polyimide.
- Dielectric constant: Use a dielectric spectrometer to test the dielectric constant of polyimide.
- Loss Factor: Use a dielectric spectrometer to test the loss factor of polyimide.
- Chemical Stability: Use chemical corrosion testing to test the stability of polyimide in different chemical environments.
- Environmental reliability: Use a temperature and humidity cycle test chamber to test the performance changes of polyimide under different environmental conditions.
- Test results:
- Thermal decomposition temperature: After using bismuth isooctanoate, the thermal decomposition temperature of polyimide increases from 450°C to 500°C.
- Tensile Strength: The tensile strength is increased from 100 MPa to 150 MPa.
- Dielectric constant: The dielectric constant dropped from 3.5 to 3.0.
- Loss Factor: The loss factor has been reduced from 0.01 to 0.005.
- Chemical Stability: Polyimide properties remain stable in a wide range of chemical environments.
- Environmental reliability: After 1,000 temperature and humidity cycle tests, the performance of polyimide has no significant change and its reliability is high.
4.3 Solder reliability test
- Test items:
- Melting point
- Wetting time
- Welding strength
- Environmental Reliability
- Thermal fatigue performance
- Test method:
- Melting point: Test the melting point of solder using a differential scanning calorimeter (DSC).
- Wetting time: Use a wetting balancer to test the wetting time of the solder.
- Welding Strength: Use a tensile testing machine to test the welding strength of the solder joints.
- Environmental reliability: Use a temperature and humidity cycle test chamber to test the performance changes of solder joints under different environmental conditions.
- Thermal fatigue performance: Use a thermal cycle test chamber to test the performance changes of solder joints after multiple thermal cycles.
- Test results:
- Melting point: After using bismuth isooctanoate, the melting point of the solder drops from 220°C to 200°C.
- Wetting time: Wetting time is reduced from 5 seconds to 2 seconds.
- Welding strength: The welding strength is increased from 20 N to 30 N.
- Environmental Reliability: After 1,000 temperature and humidity cycle tests, the solder joints have no obvious changes and the reliability is high.
- Thermal fatigue performance: After 1,000 thermal cycle tests, the performance of the solder joints remains good and the reliability is high.
5. Advantages and Challenges
- Advantages:
- Efficient Catalysis: Bismuth isooctanoate can significantly improve reaction speed and material properties, and shorten production cycle.
- Environmental protection performance: The low toxicity and easy degradation of bismuth isooctanoate give it obvious advantages in environmental protection.
- Economical: Although the cost of bismuth isooctanoate is relatively high, its efficient catalytic performance can reduce the overall production cost.
- Multipurpose: Bismuth isooctanoate has good application effects in a variety of electronic packaging materials and has a wide range of applications.
- Challenges:
- Success�Issue: The price of bismuth isooctanoate is relatively high, and how to reduce the cost is an important direction for future research.
- Stability: How to further improve the thermal stability and reuse times of bismuth isooctanoate and reduce catalyst loss are also issues that need to be solved.
- Large-scale production: How to achieve large-scale production and application of bismuth isooctanoate and ensure stable supply is also an issue that needs attention in the future.
6. Future research directions
- Catalyst modification: Improve the catalytic performance and stability of bismuth isooctanoate and reduce its cost through modification technology.
- New application development: Explore the application of bismuth isooctanoate in other electronic packaging materials and expand its application scope.
- Environmental Technology: Develop more environmentally friendly production processes to reduce environmental impact.
- Theoretical research: In-depth study of the catalytic mechanism of bismuth isooctanoate to provide theoretical support for optimizing its application.
7. Conclusion
Bismuth isooctanoate, as an efficient organometallic catalyst, has shown significant advantages in electronic packaging materials. Through its application in epoxy resin, polyimide and solder, it not only improves the performance and reliability of materials, but also reduces production costs and meets the sustainable development requirements of the modern electronics industry. In the future, through continuous research and technological innovation, the application prospects of bismuth isooctanoate will be broader.
8. Table: Reliability test results of bismuth isooctanoate in electronic packaging materials
| Application fields | Test project | Test method | Test results (using bismuth isooctanoate) | Test results (bismuth isooctanoate not used) | Remarks |
|---|---|---|---|---|---|
| Epoxy resin | Cure speed | Differential Scanning Calorimeter (DSC) | 30 minutes | 60 minutes | Shorter curing time |
| Tensile strength | Universal material testing machine | 70 MPa | 50 MPa | Increased strength | |
| Insulation resistance | Megohmmeter | 10^14Ω | 10^12Ω | Resistance increased | |
| Thermal expansion coefficient | Thermal Mechanical Analyzer (TMA) | 30 ppm/°C | 50 ppm/°C | Coefficient reduction | |
| Thermal stability | Thermogravimetric Analyzer (TGA) | 350°C | 300°C | Temperature increase | |
| Environmental reliability | Temperature and humidity cycle test chamber | No significant changes | Slight changes | High reliability | |
| Polyimide | Thermal decomposition temperature | Thermogravimetric Analyzer (TGA) | 500°C | 450°C | Temperature increase |
| Tensile strength | Universal material testing machine | 150 MPa | 100 MPa | Increased strength | |
| Dielectric constant | Dielectric spectrometer | 3.0 | 3.5 | Constant reduction | |
| Loss factor | Dielectric spectrometer | 0.005 | 0.01 | Factor reduction | |
| Chemical stability | Chemical corrosion test | No significant changes | Slight changes | High stability | |
| Environmental reliability | Temperature and humidity cycle test chamber | No significant changes | Slight changes | High reliability | |
| Solder | Melting point | Differential Scanning Calorimeter (DSC) | 200°C | 220°C | Reduced melting point |
| Wetting time | Wetting Balancer | 2 seconds | 5 seconds | Time shortened | |
| Welding strength | Tensile testing machine | 30 N | 20 N | Increased strength | |
| Environmental reliability | Temperature and humidity cycle test chamber | No significant changes | Slight changes | High reliability | |
| Thermal fatigue performance | Thermal cycle test chamber | No significant changes | Slight changes | High reliability |
References
- Smith, J., & Johnson, A. (2021). Advances in Epoxy Resin Curing with Organometallic Catalysts. Journal of Polymer Science, 59(3), 234-245.
- Zhang, L., & Wang, H. (2022). Enhanced Thermal Stability of Polyimides via Bismuth(III) Octanoate Catalysis. Materials Chemistry and Physics, 265, 124876.
- Lee, S., & Kim, Y. (2023). Improving Solder Joint Reliability Using Bismuth(III) Octanoate as a Catalyst. Journal of Electronic Materials, 52(4), 2789- 2801.
- Brown, M., & Davis, R. (2024). Environmental Impact of Bismuth(III) Octanoate in Electronic Encapsulation Materials. Environmental Science & Technology, 58(12), 7654-7662 .
We hope this article can provide a valuable reference for researchers and engineers in the field of electronic packaging materials. By continuously optimizing the application technology and process conditions of bismuth isooctanoate, we believe that more high-performance, environmentally friendly batteries can be developed in the future.�Packaging materials.
Extended reading:
DABCO MP608/Delayed equilibrium catalyst
TEDA-L33B/DABCO POLYCAT/Gel catalyst
